{"journal":{"journal_id":13221,"issn":"0960-1317","eissn":"1361-6439","name_en":"JOURNAL OF MICROMECHANICS AND MICROENGINEERING","name_short":"J MICROMECH MICROENG","name_zh":null,"first_year":2019,"last_year":2026,"n_years":6,"latest_if":2.5,"latest_if_year":2025,"first_partition":3,"last_partition":4,"trend":"down","xr_partition":4,"xr_year":2026,"has_warning":false,"has_risk":false,"legacy_only":false,"jcr_quartile":2,"jcr_year":2026,"jcr_subjects":4},"current":{"journal_id":13221,"year":2026,"source":"xinrui","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":908,"macro":"工程技术"},"meso":[],"history":[{"year":2025,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2023,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2022,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2021,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2020,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2019,"partition":3,"is_top":false,"macro":"工程技术"}],"if_single":[{"if_year":2025,"value":2.5,"edition":2026},{"if_year":2020,"value":1.881,"edition":2021},{"if_year":2019,"value":1.739,"edition":2021},{"if_year":2018,"value":2.141,"edition":2021},{"if_year":2017,"value":1.888,"edition":2020},{"if_year":2016,"value":1.794,"edition":2019},{"if_year":2015,"value":1.768,"edition":2018}],"if_editions":[{"year":2025,"if_avg3":null,"citations":8547.0},{"year":2021,"if_avg3":1.92,"citations":21625.0},{"year":2020,"if_avg3":1.923,"citations":21832.0},{"year":2019,"if_avg3":1.941,"citations":22327.0},{"year":2018,"if_avg3":1.817,"citations":21099.0}],"warnings":[],"aliases":[{"alias":"J MICROMECH MICROENG","alias_type":"short","src":"legacy"},{"alias":"JOURNAL OF MICROMECHANICS AND MICROENGINEERING","alias_type":"primary","src":"upgraded"}],"similar":[],"jcr":[{"subject":"INSTRUMENTS & INSTRUMENTATION","quartile":2,"citations":8547,"index_version":"SCIE","if_value":2.5,"if_year":2025,"year":2026},{"subject":"ENGINEERING, ELECTRICAL & ELECTRONIC","quartile":3,"citations":8547,"index_version":"SCIE","if_value":2.5,"if_year":2025,"year":2026},{"subject":"NANOSCIENCE & NANOTECHNOLOGY","quartile":3,"citations":8547,"index_version":"SCIE","if_value":2.5,"if_year":2025,"year":2026},{"subject":"PHYSICS, APPLIED","quartile":3,"citations":8547,"index_version":"SCIE","if_value":2.5,"if_year":2025,"year":2026}],"jcr_years":[2026],"jcr_year":2026,"plan":{"cas":[2025,"cas"],"xinrui":[2026,"xinrui"],"jcr":2026,"cas_years":[2025,2023,2022,2021,2020,2019],"xinrui_years":[2026]},"plan_rows":{"cas":{"journal_id":13221,"year":2025,"source":"cas","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":"SCIE","wos_status":"normal","tags":[],"seq":null,"macro":"工程技术"},"xinrui":{"journal_id":13221,"year":2026,"source":"xinrui","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":908,"macro":"工程技术"}},"mode":"latest","year":2026,"source":"xinrui","editions":[{"year":2026,"source":"xinrui","partition":4,"seq":908,"macro":"工程技术"},{"year":2025,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2023,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2022,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2021,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2020,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2019,"source":"cas","partition":3,"seq":null,"macro":"工程技术"}],"submission":{"entry":{"homepage_url":"http://iopscience.org/jmm","submission_url":null,"submission_kind":null,"author_guide_url":null,"confidence":null,"checked_at":null},"cost":{"is_oa":"NO","required":null,"apc_min":null,"apc_max":null,"currency":null,"usd_est":3325.0,"note":null,"waiver":null,"other_charges":null},"timeline":{"first_decision_days":null,"to_accept_days":null,"online_weeks":null,"text":null,"kind":null,"acceptance_rate_pct":null},"publishing":{"publisher":"IOP Publishing","country":"United Kingdom","language":null,"issn_print":null,"issn_electronic":null},"keywords":{"topics":"Advanced MEMS and NEMS Technologies; Mechanical and Optical Resonators; Microfluidic and Capillary Electrophoresis Applications; Microfluidic and Bio-sensing Technologies; Nanofabrication and Lithography Techniques; Acoustic Wave Resonator Technologies; Advanced Sensor and Energy Harvesting Materials; Force Microscopy Techniques and Applications; Advanced Surface Polishing Techniques; Electrowetting and Microfluidic Technologies; Innovative Microfluidic and Catalytic Techniques Innovation; Photonic and Optical Devices; 3D IC and TSV technologies; Nanowire Synthesis and Applications; Adhesion, Friction, and Surface Interactions; Analytical Chemistry and Sensors; Semiconductor materials and devices; Electrohydrodynamics and Fluid Dynamics; Surface Modification and Superhydrophobicity; Neuroscience and Neural Engineering; Innovative Energy Harvesting Technologies; Heat Transfer and Optimization; Metal and Thin Film Mechanics; Advanced machining processes and optimization; Nanomaterials and Printing Technologies","scope_text":null,"article_types":null},"completeness":66,"updated_at":"2026-09-16T14:23:32.464460+00:00"}}