{"journal":{"journal_id":21155,"issn":"2156-3950","eissn":"2156-3985","name_en":"IEEE Transactions on Components Packaging and Manufacturing Technology","name_short":"IEEE T COMP PACK MAN","name_zh":null,"first_year":2019,"last_year":2026,"n_years":6,"latest_if":3.3,"latest_if_year":2025,"first_partition":3,"last_partition":3,"trend":"stable","xr_partition":3,"xr_year":2026,"has_warning":false,"has_risk":false,"legacy_only":false,"jcr_quartile":2,"jcr_year":2026,"jcr_subjects":3},"current":{"journal_id":21155,"year":2026,"source":"xinrui","partition":3,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":531,"macro":"工程技术"},"meso":[],"history":[{"year":2025,"partition":3,"is_top":false,"macro":"工程技术"},{"year":2023,"partition":3,"is_top":false,"macro":"工程技术"},{"year":2022,"partition":3,"is_top":false,"macro":"工程技术"},{"year":2021,"partition":3,"is_top":false,"macro":"工程技术"},{"year":2020,"partition":3,"is_top":false,"macro":"工程技术"},{"year":2019,"partition":3,"is_top":false,"macro":"工程技术"}],"if_single":[{"if_year":2025,"value":3.3,"edition":2026},{"if_year":2020,"value":1.738,"edition":2021},{"if_year":2019,"value":1.889,"edition":2021},{"if_year":2018,"value":1.86,"edition":2021},{"if_year":2017,"value":1.66,"edition":2020},{"if_year":2016,"value":1.581,"edition":2019},{"if_year":2015,"value":1.151,"edition":2018}],"if_editions":[{"year":2025,"if_avg3":null,"citations":9844.0},{"year":2021,"if_avg3":1.829,"citations":11656.0},{"year":2020,"if_avg3":1.803,"citations":11280.0},{"year":2019,"if_avg3":1.7,"citations":10786.0},{"year":2018,"if_avg3":1.464,"citations":10257.0}],"warnings":[],"aliases":[{"alias":"IEEE T COMP PACK MAN","alias_type":"short","src":"legacy"},{"alias":"IEEE Transactions on Components Packaging and Manufacturing Technology","alias_type":"primary","src":"upgraded"}],"similar":[],"jcr":[{"subject":"ENGINEERING, ELECTRICAL & ELECTRONIC","quartile":2,"citations":9844,"index_version":"SCIE","if_value":3.3,"if_year":2025,"year":2026},{"subject":"ENGINEERING, MANUFACTURING","quartile":3,"citations":9844,"index_version":"SCIE","if_value":3.3,"if_year":2025,"year":2026},{"subject":"MATERIALS SCIENCE, MULTIDISCIPLINARY","quartile":3,"citations":9844,"index_version":"SCIE","if_value":3.3,"if_year":2025,"year":2026}],"jcr_years":[2026],"jcr_year":2026,"plan":{"cas":[2025,"cas"],"xinrui":[2026,"xinrui"],"jcr":2026,"cas_years":[2025,2023,2022,2021,2020,2019],"xinrui_years":[2026]},"plan_rows":{"cas":{"journal_id":21155,"year":2025,"source":"cas","partition":3,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":"SCIE","wos_status":"normal","tags":[],"seq":null,"macro":"工程技术"},"xinrui":{"journal_id":21155,"year":2026,"source":"xinrui","partition":3,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":531,"macro":"工程技术"}},"mode":"latest","year":2026,"source":"xinrui","editions":[{"year":2026,"source":"xinrui","partition":3,"seq":531,"macro":"工程技术"},{"year":2025,"source":"cas","partition":3,"seq":null,"macro":"工程技术"},{"year":2023,"source":"cas","partition":3,"seq":null,"macro":"工程技术"},{"year":2022,"source":"cas","partition":3,"seq":null,"macro":"工程技术"},{"year":2021,"source":"cas","partition":3,"seq":null,"macro":"工程技术"},{"year":2020,"source":"cas","partition":3,"seq":null,"macro":"工程技术"},{"year":2019,"source":"cas","partition":3,"seq":null,"macro":"工程技术"}],"submission":{"entry":{"homepage_url":null,"submission_url":null,"submission_kind":null,"author_guide_url":null,"confidence":null,"checked_at":null},"cost":{"is_oa":"NO","required":null,"apc_min":null,"apc_max":null,"currency":null,"usd_est":2645.0,"note":null,"waiver":null,"other_charges":null},"timeline":{"first_decision_days":32,"to_accept_days":null,"online_weeks":null,"text":"一审约 32 天","kind":"aggregate","acceptance_rate_pct":null},"publishing":{"publisher":"Institute of Electrical and Electronics Engineers","country":"United States","language":null,"issn_print":null,"issn_electronic":null},"keywords":{"topics":"Electronic Packaging and Soldering Technologies; 3D IC and TSV technologies; Microwave Engineering and Waveguides; Electromagnetic Compatibility and Noise Suppression; Advanced Antenna and Metasurface Technologies; Silicon Carbide Semiconductor Technologies; Heat Transfer and Optimization; Radio Frequency Integrated Circuit Design; Antenna Design and Analysis; Ferroelectric and Negative Capacitance Devices; Semiconductor Lasers and Optical Devices; Copper Interconnects and Reliability; Semiconductor materials and devices; Integrated Circuits and Semiconductor Failure Analysis; Electrostatic Discharge in Electronics; Electrical Contact Performance and Analysis; Adhesion, Friction, and Surface Interactions; Wireless Body Area Networks; Advanced Sensor and Energy Harvesting Materials; Nanofabrication and Lithography Techniques; Bluetooth and Wireless Communication Technologies; Photonic and Optical Devices; Diverse Scientific and Economic Studies; Thermal properties of materials; Heat Transfer and Boiling Studies","scope_text":null,"article_types":null},"completeness":46,"updated_at":"2026-09-16T14:23:39.245974+00:00"}}