{"journal":{"journal_id":22174,"issn":"0161-0457","eissn":null,"name_en":"SCANNING","name_short":"SCANNING","name_zh":null,"first_year":2019,"last_year":2022,"n_years":4,"latest_if":1.932,"latest_if_year":2020,"first_partition":4,"last_partition":4,"trend":"stable","xr_partition":null,"xr_year":null,"has_warning":false,"has_risk":false,"legacy_only":false,"jcr_quartile":null,"jcr_year":null,"jcr_subjects":null},"current":{"journal_id":22174,"year":2022,"source":"cas","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":true,"wos_index":"SCIE","wos_status":"normal","tags":[],"seq":null,"macro":"工程技术"},"meso":[{"code":"OA","name":"INSTRUMENTS & INSTRUMENTATION 仪器仪表","partition":4},{"code":"RA","name":"MICROSCOPY 显微镜技术","partition":4}],"history":[{"year":2022,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2021,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2020,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2019,"partition":4,"is_top":false,"macro":"工程技术"}],"if_single":[{"if_year":2020,"value":1.932,"edition":2021},{"if_year":2019,"value":1.33,"edition":2021},{"if_year":2018,"value":1.242,"edition":2021},{"if_year":2017,"value":0.994,"edition":2020},{"if_year":2016,"value":1.345,"edition":2019},{"if_year":2015,"value":1.304,"edition":2018}],"if_editions":[{"year":2021,"if_avg3":1.501,"citations":3179.0},{"year":2020,"if_avg3":1.189,"citations":2688.0},{"year":2019,"if_avg3":1.194,"citations":2347.0},{"year":2018,"if_avg3":1.214,"citations":2128.0}],"warnings":[],"aliases":[{"alias":"SCANNING","alias_type":"primary","src":"upgraded"},{"alias":"SCANNING","alias_type":"short","src":"legacy"}],"similar":[{"journal_id":4408,"name_en":"JOURNAL OF RESEARCH OF THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY","issn":"1044-677X","partition":4,"is_top":false,"warn":false,"shared":1},{"journal_id":174,"name_en":"INSTRUMENTS AND EXPERIMENTAL TECHNIQUES","issn":"0020-4412","partition":4,"is_top":false,"warn":false,"shared":1},{"journal_id":10809,"name_en":"tm-Technisches Messen","issn":"0171-8096","partition":4,"is_top":false,"warn":false,"shared":1},{"journal_id":6399,"name_en":"Journal of Instrumentation","issn":"1748-0221","partition":4,"is_top":false,"warn":false,"shared":1},{"journal_id":3847,"name_en":"Journal of Sensors","issn":"1687-725X","partition":4,"is_top":false,"warn":true,"shared":1},{"journal_id":3177,"name_en":"Microscopy","issn":"2050-5698","partition":4,"is_top":false,"warn":false,"shared":1},{"journal_id":13221,"name_en":"JOURNAL OF MICROMECHANICS AND MICROENGINEERING","issn":"0960-1317","partition":4,"is_top":false,"warn":false,"shared":1},{"journal_id":11084,"name_en":"INSIGHT","issn":"1354-2575","partition":4,"is_top":false,"warn":false,"shared":1}],"jcr":[],"jcr_years":[],"jcr_year":null,"plan":{"cas":[2025,"cas"],"xinrui":[2026,"xinrui"],"jcr":2026,"cas_years":[2025,2023,2022,2021,2020,2019],"xinrui_years":[2026]},"plan_rows":{"cas":null,"xinrui":null},"mode":"latest","year":2022,"source":"cas","editions":[{"year":2022,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2021,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2020,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2019,"source":"cas","partition":4,"seq":null,"macro":"工程技术"}],"submission":{"entry":{"homepage_url":"https://www.hindawi.com/journals/scanning/","submission_url":"https://www.hindawi.com/journals/scanning/guidelines/","submission_kind":"system","author_guide_url":null,"confidence":60,"checked_at":"2026-09-16T07:43:33.980490+00:00"},"cost":{"is_oa":"NO","required":null,"apc_min":null,"apc_max":null,"currency":null,"usd_est":1500.0,"note":null,"waiver":null,"other_charges":null},"timeline":{"first_decision_days":null,"to_accept_days":null,"online_weeks":null,"text":null,"kind":null,"acceptance_rate_pct":null},"publishing":{"publisher":"Wiley","country":"United Kingdom","language":null,"issn_print":null,"issn_electronic":null},"keywords":{"topics":"Electron and X-Ray Spectroscopy Techniques; Advancements in Photolithography Techniques; Advanced Electron Microscopy Techniques and Applications; Force Microscopy Techniques and Applications; Integrated Circuits and Semiconductor Failure Analysis; Dental materials and restorations; Applied Advanced Technologies; X-ray Spectroscopy and Fluorescence Analysis; Endodontics and Root Canal Treatments; Diverse Scientific and Economic Studies; Advanced Fluorescence Microscopy Techniques; Human auditory perception and evaluation; Non-Destructive Testing Techniques; Near-Field Optical Microscopy; Surface and Thin Film Phenomena; Semiconductor materials and devices; Ion-surface interactions and analysis; Dental Radiography and Imaging; Surface Roughness and Optical Measurements; Corrosion Behavior and Inhibition; Diverse Specialized Academic Research; Photoacoustic and Ultrasonic Imaging; Advanced Technologies and Applied Computing; Mechanical and Optical Resonators; Advanced Materials Characterization Techniques","scope_text":null,"article_types":null},"completeness":72,"updated_at":"2026-09-16T14:23:41.207842+00:00"}}