{"journal":{"journal_id":4043,"issn":"1356-5362","eissn":"1758-812X","name_en":"MICROELECTRONICS INTERNATIONAL","name_short":"MICROELECTRON INT","name_zh":null,"first_year":2019,"last_year":2026,"n_years":6,"latest_if":1.0,"latest_if_year":2025,"first_partition":4,"last_partition":4,"trend":"stable","xr_partition":4,"xr_year":2026,"has_warning":false,"has_risk":false,"legacy_only":false,"jcr_quartile":4,"jcr_year":2026,"jcr_subjects":2},"current":{"journal_id":4043,"year":2026,"source":"xinrui","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":1110,"macro":"工程技术"},"meso":[],"history":[{"year":2025,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2023,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2022,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2021,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2020,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2019,"partition":4,"is_top":false,"macro":"工程技术"}],"if_single":[{"if_year":2025,"value":1.0,"edition":2026},{"if_year":2020,"value":0.758,"edition":2021},{"if_year":2019,"value":0.796,"edition":2021},{"if_year":2018,"value":0.84,"edition":2021},{"if_year":2017,"value":0.608,"edition":2020},{"if_year":2016,"value":0.737,"edition":2019},{"if_year":2015,"value":0.519,"edition":2018}],"if_editions":[{"year":2025,"if_avg3":null,"citations":330.0},{"year":2021,"if_avg3":0.798,"citations":491.0},{"year":2020,"if_avg3":0.748,"citations":454.0},{"year":2019,"if_avg3":0.728,"citations":377.0},{"year":2018,"if_avg3":0.621,"citations":383.0}],"warnings":[],"aliases":[{"alias":"MICROELECTRON INT","alias_type":"short","src":"legacy"},{"alias":"MICROELECTRONICS INTERNATIONAL","alias_type":"primary","src":"upgraded"}],"similar":[],"jcr":[{"subject":"ENGINEERING, ELECTRICAL & ELECTRONIC","quartile":4,"citations":330,"index_version":"SCIE","if_value":1.0,"if_year":2025,"year":2026},{"subject":"MATERIALS SCIENCE, MULTIDISCIPLINARY","quartile":4,"citations":330,"index_version":"SCIE","if_value":1.0,"if_year":2025,"year":2026}],"jcr_years":[2026],"jcr_year":2026,"plan":{"cas":[2025,"cas"],"xinrui":[2026,"xinrui"],"jcr":2026,"cas_years":[2025,2023,2022,2021,2020,2019],"xinrui_years":[2026]},"plan_rows":{"cas":{"journal_id":4043,"year":2025,"source":"cas","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":"SCIE","wos_status":"normal","tags":[],"seq":null,"macro":"工程技术"},"xinrui":{"journal_id":4043,"year":2026,"source":"xinrui","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":1110,"macro":"工程技术"}},"mode":"latest","year":2026,"source":"xinrui","editions":[{"year":2026,"source":"xinrui","partition":4,"seq":1110,"macro":"工程技术"},{"year":2025,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2023,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2022,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2021,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2020,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2019,"source":"cas","partition":4,"seq":null,"macro":"工程技术"}],"submission":{"entry":{"homepage_url":"http://emeraldinsight.com/products/journals/journals.htm?id=mi","submission_url":null,"submission_kind":null,"author_guide_url":null,"confidence":null,"checked_at":null},"cost":{"is_oa":"NO","required":null,"apc_min":null,"apc_max":null,"currency":null,"usd_est":null,"note":null,"waiver":null,"other_charges":null},"timeline":{"first_decision_days":null,"to_accept_days":null,"online_weeks":null,"text":null,"kind":null,"acceptance_rate_pct":null},"publishing":{"publisher":"Emerald Publishing Limited","country":"United Kingdom","language":null,"issn_print":null,"issn_electronic":null},"keywords":{"topics":"3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; Electrical and Thermal Properties of Materials; Advancements in Semiconductor Devices and Circuit Design; Semiconductor materials and devices; Semiconductor Lasers and Optical Devices; Biotechnology and Related Fields; Electromagnetic Compatibility and Noise Suppression; Diverse Scientific and Economic Studies; Ferroelectric and Piezoelectric Materials; Integrated Circuits and Semiconductor Failure Analysis; Advanced MEMS and NEMS Technologies; Silicon and Solar Cell Technologies; VLSI and Analog Circuit Testing; Microwave Dielectric Ceramics Synthesis; Advanced Sensor and Energy Harvesting Materials; Gas Sensing Nanomaterials and Sensors; Manufacturing Process and Optimization; Microwave Engineering and Waveguides; Silicon Carbide Semiconductor Technologies; Low-power high-performance VLSI design; Radio Frequency Integrated Circuit Design; Analog and Mixed-Signal Circuit Design; GaN-based semiconductor devices and materials; Diaspora, migration, transnational identity","scope_text":null,"article_types":null},"completeness":50,"updated_at":"2026-09-16T14:23:25.900235+00:00"}}