{"journal":{"journal_id":8244,"issn":"2166-2746","eissn":"2166-2754","name_en":"JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B","name_short":"J VAC SCI TECHNOL B","name_zh":null,"first_year":2020,"last_year":2026,"n_years":5,"latest_if":1.6,"latest_if_year":2025,"first_partition":4,"last_partition":4,"trend":"stable","xr_partition":4,"xr_year":2026,"has_warning":false,"has_risk":false,"legacy_only":false,"jcr_quartile":4,"jcr_year":2026,"jcr_subjects":3},"current":{"journal_id":8244,"year":2026,"source":"xinrui","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":1133,"macro":"工程技术"},"meso":[],"history":[{"year":2025,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2023,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2022,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2021,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2020,"partition":4,"is_top":false,"macro":"工程技术"}],"if_single":[{"if_year":2025,"value":1.6,"edition":2026},{"if_year":2020,"value":1.416,"edition":2021},{"if_year":2019,"value":1.511,"edition":2021},{"if_year":2018,"value":1.351,"edition":2021},{"if_year":2017,"value":1.314,"edition":2020}],"if_editions":[{"year":2025,"if_avg3":null,"citations":7077.0},{"year":2021,"if_avg3":1.426,"citations":15846.0},{"year":2020,"if_avg3":1.392,"citations":15832.0}],"warnings":[],"aliases":[{"alias":"J VAC SCI TECHNOL B","alias_type":"short","src":"legacy"},{"alias":"JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B","alias_type":"primary","src":"upgraded"}],"similar":[],"jcr":[{"subject":"ENGINEERING, ELECTRICAL & ELECTRONIC","quartile":4,"citations":7077,"index_version":"SCIE","if_value":1.6,"if_year":2025,"year":2026},{"subject":"NANOSCIENCE & NANOTECHNOLOGY","quartile":4,"citations":7077,"index_version":"SCIE","if_value":1.6,"if_year":2025,"year":2026},{"subject":"PHYSICS, APPLIED","quartile":4,"citations":7077,"index_version":"SCIE","if_value":1.6,"if_year":2025,"year":2026}],"jcr_years":[2026],"jcr_year":2026,"plan":{"cas":[2025,"cas"],"xinrui":[2026,"xinrui"],"jcr":2026,"cas_years":[2025,2023,2022,2021,2020,2019],"xinrui_years":[2026]},"plan_rows":{"cas":{"journal_id":8244,"year":2025,"source":"cas","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":"SCIE","wos_status":"normal","tags":[],"seq":null,"macro":"工程技术"},"xinrui":{"journal_id":8244,"year":2026,"source":"xinrui","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":1133,"macro":"工程技术"}},"mode":"latest","year":2026,"source":"xinrui","editions":[{"year":2026,"source":"xinrui","partition":4,"seq":1133,"macro":"工程技术"},{"year":2025,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2023,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2022,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2021,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2020,"source":"cas","partition":4,"seq":null,"macro":"工程技术"}],"submission":{"entry":{"homepage_url":"http://scitation.aip.org/content/avs/journal/jvst","submission_url":null,"submission_kind":null,"author_guide_url":null,"confidence":null,"checked_at":null},"cost":{"is_oa":"NO","required":null,"apc_min":null,"apc_max":null,"currency":null,"usd_est":null,"note":null,"waiver":null,"other_charges":null},"timeline":{"first_decision_days":null,"to_accept_days":null,"online_weeks":null,"text":null,"kind":null,"acceptance_rate_pct":null},"publishing":{"publisher":null,"country":"United States","language":null,"issn_print":null,"issn_electronic":null},"keywords":{"topics":"Semiconductor materials and devices; Advancements in Photolithography Techniques; Integrated Circuits and Semiconductor Failure Analysis; GaN-based semiconductor devices and materials; Nanofabrication and Lithography Techniques; ZnO doping and properties; Ion-surface interactions and analysis; Nanowire Synthesis and Applications; Semiconductor Quantum Structures and Devices; Advancements in Semiconductor Devices and Circuit Design; Metal and Thin Film Mechanics; Diamond and Carbon-based Materials Research; Electron and X-Ray Spectroscopy Techniques; Ga2O3 and related materials; Graphene research and applications; Force Microscopy Techniques and Applications; Carbon Nanotubes in Composites; Plasma Diagnostics and Applications; Semiconductor materials and interfaces; Optical Coatings and Gratings; Thin-Film Transistor Technologies; Electronic and Structural Properties of Oxides; Advanced Surface Polishing Techniques; Copper Interconnects and Reliability; Photonic and Optical Devices","scope_text":null,"article_types":null},"completeness":44,"updated_at":"2026-09-16T14:23:27.695223+00:00"}}