{"journal":{"journal_id":8734,"issn":"1043-7398","eissn":"1528-9044","name_en":"JOURNAL OF ELECTRONIC PACKAGING","name_short":"J ELECTRON PACKAGING","name_zh":null,"first_year":2019,"last_year":2026,"n_years":6,"latest_if":2.2,"latest_if_year":2025,"first_partition":4,"last_partition":4,"trend":"stable","xr_partition":4,"xr_year":2026,"has_warning":false,"has_risk":false,"legacy_only":false,"jcr_quartile":3,"jcr_year":2026,"jcr_subjects":2},"current":{"journal_id":8734,"year":2026,"source":"xinrui","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":918,"macro":"工程技术"},"meso":[],"history":[{"year":2025,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2023,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2022,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2021,"partition":4,"is_top":false,"macro":"工程技术"},{"year":2020,"partition":3,"is_top":false,"macro":"工程技术"},{"year":2019,"partition":4,"is_top":false,"macro":"工程技术"}],"if_single":[{"if_year":2025,"value":2.2,"edition":2026},{"if_year":2020,"value":1.843,"edition":2021},{"if_year":2019,"value":1.787,"edition":2021},{"if_year":2018,"value":1.99,"edition":2021},{"if_year":2017,"value":2.21,"edition":2020},{"if_year":2016,"value":1.596,"edition":2019},{"if_year":2015,"value":1.402,"edition":2018}],"if_editions":[{"year":2025,"if_avg3":null,"citations":2098.0},{"year":2021,"if_avg3":1.873,"citations":2874.0},{"year":2020,"if_avg3":1.995,"citations":2724.0},{"year":2019,"if_avg3":1.932,"citations":2537.0},{"year":2018,"if_avg3":1.736,"citations":2476.0}],"warnings":[],"aliases":[{"alias":"J ELECTRON PACKAGING","alias_type":"short","src":"legacy"},{"alias":"JOURNAL OF ELECTRONIC PACKAGING","alias_type":"primary","src":"upgraded"}],"similar":[],"jcr":[{"subject":"ENGINEERING, ELECTRICAL & ELECTRONIC","quartile":3,"citations":2098,"index_version":"SCIE","if_value":2.2,"if_year":2025,"year":2026},{"subject":"ENGINEERING, MECHANICAL","quartile":3,"citations":2098,"index_version":"SCIE","if_value":2.2,"if_year":2025,"year":2026}],"jcr_years":[2026],"jcr_year":2026,"plan":{"cas":[2025,"cas"],"xinrui":[2026,"xinrui"],"jcr":2026,"cas_years":[2025,2023,2022,2021,2020,2019],"xinrui_years":[2026]},"plan_rows":{"cas":{"journal_id":8734,"year":2025,"source":"cas","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":"SCIE","wos_status":"normal","tags":[],"seq":null,"macro":"工程技术"},"xinrui":{"journal_id":8734,"year":2026,"source":"xinrui","partition":4,"is_top":false,"is_review":false,"oaj":false,"open_access":false,"wos_index":null,"wos_status":"normal","tags":[],"seq":918,"macro":"工程技术"}},"mode":"latest","year":2026,"source":"xinrui","editions":[{"year":2026,"source":"xinrui","partition":4,"seq":918,"macro":"工程技术"},{"year":2025,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2023,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2022,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2021,"source":"cas","partition":4,"seq":null,"macro":"工程技术"},{"year":2020,"source":"cas","partition":3,"seq":null,"macro":"工程技术"},{"year":2019,"source":"cas","partition":4,"seq":null,"macro":"工程技术"}],"submission":{"entry":{"homepage_url":"http://books.google.com/books?id=bFlKAQAAIAAJ","submission_url":null,"submission_kind":null,"author_guide_url":null,"confidence":null,"checked_at":null},"cost":{"is_oa":"NO","required":null,"apc_min":null,"apc_max":null,"currency":null,"usd_est":null,"note":null,"waiver":null,"other_charges":null},"timeline":{"first_decision_days":null,"to_accept_days":null,"online_weeks":null,"text":null,"kind":null,"acceptance_rate_pct":null},"publishing":{"publisher":"ASM International","country":"United States","language":null,"issn_print":null,"issn_electronic":null},"keywords":{"topics":"Electronic Packaging and Soldering Technologies; Heat Transfer and Optimization; 3D IC and TSV technologies; Heat Transfer and Boiling Studies; Heat Transfer Mechanisms; Adhesion, Friction, and Surface Interactions; Mechanical Behavior of Composites; Thermal properties of materials; Silicon Carbide Semiconductor Technologies; Metal Forming Simulation Techniques; Material Properties and Processing; Integrated Circuits and Semiconductor Failure Analysis; Aluminum Alloys Composites Properties; Advanced Welding Techniques Analysis; Additive Manufacturing and 3D Printing Technologies; Nanofluid Flow and Heat Transfer; Metallurgy and Material Forming; Fatigue and fracture mechanics; Electromagnetic Compatibility and Noise Suppression; Copper Interconnects and Reliability; Advanced Sensor and Energy Harvesting Materials; Fluid Dynamics and Turbulent Flows; Fluid Dynamics and Thin Films; Nanomaterials and Printing Technologies; Vibration and Dynamic Analysis","scope_text":null,"article_types":null},"completeness":50,"updated_at":"2026-09-16T14:23:27.695223+00:00"}}