主题词：Semiconductor materials and devices; Advancements in Semiconductor Devices and Circuit Design; Integrated Circuits and Semiconductor Failure Analysis; Electronic Packaging and Soldering Technologies; Ferroelectric and Negative Capacitance Devices; Silicon Carbide Semiconductor Technologies; Electrostatic Discharge in Electronics; Radiation Effects in Electronics; VLSI and Analog Circuit Testing; 3D IC and TSV technologies; GaN-based semiconductor devices and materials; Copper Interconnects and Reliability; Advanced Memory and Neural Computing; Electromagnetic Compatibility and Noise Suppression; Thin-Film Transistor Technologies; Low-power high-performance VLSI design; Semiconductor materials and interfaces; Diverse Scientific and Economic Studies; Reliability and Maintenance Optimization; Silicon and Solar Cell Technologies; Semiconductor Quantum Structures and Devices; Wireless Body Area Networks; Bluetooth and Wireless Communication Technologies; Radio Frequency Integrated Circuit Design; ZnO doping and properties