主题词：Electronic Packaging and Soldering Technologies; 3D IC and TSV technologies; Microwave Engineering and Waveguides; Electromagnetic Compatibility and Noise Suppression; Advanced Antenna and Metasurface Technologies; Silicon Carbide Semiconductor Technologies; Heat Transfer and Optimization; Radio Frequency Integrated Circuit Design; Antenna Design and Analysis; Ferroelectric and Negative Capacitance Devices; Semiconductor Lasers and Optical Devices; Copper Interconnects and Reliability; Semiconductor materials and devices; Integrated Circuits and Semiconductor Failure Analysis; Electrostatic Discharge in Electronics; Electrical Contact Performance and Analysis; Adhesion, Friction, and Surface Interactions; Wireless Body Area Networks; Advanced Sensor and Energy Harvesting Materials; Nanofabrication and Lithography Techniques; Bluetooth and Wireless Communication Technologies; Photonic and Optical Devices; Diverse Scientific and Economic Studies; Thermal properties of materials; Heat Transfer and Boiling Studies