主题词：3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; Electrical and Thermal Properties of Materials; Advancements in Semiconductor Devices and Circuit Design; Semiconductor materials and devices; Semiconductor Lasers and Optical Devices; Biotechnology and Related Fields; Electromagnetic Compatibility and Noise Suppression; Diverse Scientific and Economic Studies; Ferroelectric and Piezoelectric Materials; Integrated Circuits and Semiconductor Failure Analysis; Advanced MEMS and NEMS Technologies; Silicon and Solar Cell Technologies; VLSI and Analog Circuit Testing; Microwave Dielectric Ceramics Synthesis; Advanced Sensor and Energy Harvesting Materials; Gas Sensing Nanomaterials and Sensors; Manufacturing Process and Optimization; Microwave Engineering and Waveguides; Silicon Carbide Semiconductor Technologies; Low-power high-performance VLSI design; Radio Frequency Integrated Circuit Design; Analog and Mixed-Signal Circuit Design; GaN-based semiconductor devices and materials; Diaspora, migration, transnational identity