主题词：Electronic Packaging and Soldering Technologies; Heat Transfer and Optimization; 3D IC and TSV technologies; Heat Transfer and Boiling Studies; Heat Transfer Mechanisms; Adhesion, Friction, and Surface Interactions; Mechanical Behavior of Composites; Thermal properties of materials; Silicon Carbide Semiconductor Technologies; Metal Forming Simulation Techniques; Material Properties and Processing; Integrated Circuits and Semiconductor Failure Analysis; Aluminum Alloys Composites Properties; Advanced Welding Techniques Analysis; Additive Manufacturing and 3D Printing Technologies; Nanofluid Flow and Heat Transfer; Metallurgy and Material Forming; Fatigue and fracture mechanics; Electromagnetic Compatibility and Noise Suppression; Copper Interconnects and Reliability; Advanced Sensor and Energy Harvesting Materials; Fluid Dynamics and Turbulent Flows; Fluid Dynamics and Thin Films; Nanomaterials and Printing Technologies; Vibration and Dynamic Analysis